TELKOMNIKA Telecommunication, Computing, Electronics and Control
Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate
Dublin Core
Title
TELKOMNIKA Telecommunication, Computing, Electronics and Control
Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate
Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate
Subject
FR-4, Ku-band, Low noise amplifier, Stepped impedance matching
Description
The low noise amplifier (LNA) plays an important role in many
communication systems, especially at the receiver’s front-ends. In modern RF designs, The LNA is usually fabricated on a microstrip printed circuit board (PCB) due to its simplicity and ability of integrating flexibly with other components in a receiving circuitry unit. At frequencies lower than 6 GHz, the most prevalent substrate material for a microstrip LNA is FR-4 while at higher frequencies of over 10 GHz, it is challenging to design the LNA using this material without causing considerable losses to the RF signal. There are many works related to design microstrip LNA at high frequencies, however, the dielectric substrates used in most of them were high-cost materials for low dielectric loss. This paper introduces an LNA topology using the common, low-cost FR-4 substrate which can be operated in Ku-band for applications such as small satellites’ receivers, with the expected noise figure of lower than 1 dB, gain of around 10 dB and the return loss of around -10 dB. The stepped impedance matching technique has been used for transmission line optimization. The simulated and measured results are presented.
communication systems, especially at the receiver’s front-ends. In modern RF designs, The LNA is usually fabricated on a microstrip printed circuit board (PCB) due to its simplicity and ability of integrating flexibly with other components in a receiving circuitry unit. At frequencies lower than 6 GHz, the most prevalent substrate material for a microstrip LNA is FR-4 while at higher frequencies of over 10 GHz, it is challenging to design the LNA using this material without causing considerable losses to the RF signal. There are many works related to design microstrip LNA at high frequencies, however, the dielectric substrates used in most of them were high-cost materials for low dielectric loss. This paper introduces an LNA topology using the common, low-cost FR-4 substrate which can be operated in Ku-band for applications such as small satellites’ receivers, with the expected noise figure of lower than 1 dB, gain of around 10 dB and the return loss of around -10 dB. The stepped impedance matching technique has been used for transmission line optimization. The simulated and measured results are presented.
Creator
Linh Ta Phuong, Bernard Journet, Duong Bach Gia
Source
DOI: 10.12928/TELKOMNIKA.v18i1.13196
Publisher
Universitas Ahmad Dahlan
Date
February 2020
Contributor
Sri Wahyuni
Rights
ISSN: 1693-6930
Relation
http://journal.uad.ac.id/index.php/TELKOMNIKA
Format
PDF
Language
English
Type
Text
Coverage
TELKOMNIKA Telecommunication, Computing, Electronics and Control
Files
Collection
Citation
Linh Ta Phuong, Bernard Journet, Duong Bach Gia, “TELKOMNIKA Telecommunication, Computing, Electronics and Control
Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate,” Repository Horizon University Indonesia, accessed February 5, 2025, https://repository.horizon.ac.id/items/show/3583.
Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate,” Repository Horizon University Indonesia, accessed February 5, 2025, https://repository.horizon.ac.id/items/show/3583.