TELKOMNIKA Telecommunication, Computing, Electronics and Control
TiO2/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LEDs

Dublin Core

Title

TELKOMNIKA Telecommunication, Computing, Electronics and Control
TiO2/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LEDs

Subject

Color uniformity
Luminous flux
Mie-scattering theory
TiO2

Description

TiO2 nanoparticle and silicon composite has powerful effect of scattering, thus
it is famous in enhancing the scattered light in light-emitting diode (LED)
packages. To accomplish higher lighting performance in LED devices, a thin
encapsulation layer of TiO2 with high concentration and silicon glue is
introduced to complement the main encapsulation one. After conducting
experiments, the results present that in the case of the main encapsulation
including only silicone, the light extraction efficiency (LEE) of COB LEDs
increases to 65%. On the other hand, when there is the additional layer of TiO2
and silicone, the improvement of LEE depends on the concentration of TiO2.
As this nanoparticle concentration decreases from 0.12 to 0.035 g/cm3
, the
LEE can be enhanced from 6% to 24%. Moreover, at the average correlated
color temperature (CCT) of approximately 8500 K, the layer of TiO2/silicone
composite can help to accomplish the reduction of the angular correlated color
temperature (CCT) deviation, from 900 to 470 K, within −90° to 90° viewing
angle range.

Creator

My Hanh Nguyen Thi, Phung Ton That

Source

http://journal.uad.ac.id/index.php/TELKOMNIKA

Date

Oct 7, 2020

Contributor

peri irawan

Format

pdf

Language

english

Type

text

Files

Collection

Tags

,Repository, Repository Horizon University Indonesia, Repository Universitas Horizon Indonesia, Horizon.ac.id, Horizon University Indonesia, Universitas Horizon Indonesia, HorizonU, Repo Horizon , ,Repository, Repository Horizon University Indonesia, Repository Universitas Horizon Indonesia, Horizon.ac.id, Horizon University Indonesia, Universitas Horizon Indonesia, HorizonU, Repo Horizon , ,Repository, Repository Horizon University Indonesia, Repository Universitas Horizon Indonesia, Horizon.ac.id, Horizon University Indonesia, Universitas Horizon Indonesia, HorizonU, Repo Horizon , ,Repository, Repository Horizon University Indonesia, Repository Universitas Horizon Indonesia, Horizon.ac.id, Horizon University Indonesia, Universitas Horizon Indonesia, HorizonU, Repo Horizon ,

Citation

My Hanh Nguyen Thi, Phung Ton That, “TELKOMNIKA Telecommunication, Computing, Electronics and Control
TiO2/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LEDs,” Repository Horizon University Indonesia, accessed March 13, 2025, https://repository.horizon.ac.id/items/show/3701.